FAQ
The core differences between assembly and molded inductors lie in their manufacturing processes and physical structures.
• Assembly Inductors: Manufactured by assembling coils with pre-formed magnetic cores, resulting in a structure with distinct air gaps.
• Molded Inductors: Constructed by placing pre-wound coils into a mold, filling it with magnetic powder (typically iron or alloy powder), and applying tonnage-level pressure to form a gapless structure.
Due to this gapless design, molded inductors effectively minimize EMI and acoustic noise. Furthermore, the molding process allows for smaller, lower-profile form factors, making them ideal for space-constrained and cost-sensitive applications.
The primary advantage of the magnetic powder is its soft saturation characteristic.
Soft saturation means that as the DC current increases, the inductance drops gradually rather than dropping abruptly.
This prevents a sudden collapse of inductance, thereby protecting the circuit from current spikes.
Isat (Saturation Current): Defines the amount of DC current that causes the inductance to drop by a specified percentage (typically 20% or 30%) due to magnetic saturation.
Irms (RMS Current): Focuses on the temperature rise of the inductor body, representing the continuous DC current that causes the component's temperature to increase by a specified increment (typically △T=40℃).
The main advantages of molded inductors include compact size, low EMI, and soft saturation performance. Consequently, they are highly suitable for applications with strict space limitations, stringent EMI requirements, or potential risks of sudden inductance collapse.
Assembly Inductors: Typically offer lower DCR, lower core loss, and higher rated voltage.
This makes them exceptionally well-suited for high-current and high step-up/down ratio applications, such as core power supplies for CPUs, GPUs, and ASICs.
Molded Inductors: Feature highly flexible dimensions and better cost-efficiency. They are ideal for applications with severe space constraints, lower step-up/down ratios, or peripheral power rails (side rails) with moderate Isat requirements.
We generally do not recommend using molded inductors in applications with very high step-up/down voltage ratios, as they have relatively lower rated voltages compared to assembly inductors. Molded inductors are composed of high-density metal powders, where insulation relies entirely on a thin coating layer over each particle. During the high-tonnage compaction process, this coating layer can be slightly compromised, reducing the insulation resistance between the powder particles. When a high voltage is applied, this lower insulation resistance may lead to increased leakage current. Therefore, for designs requiring high voltage conversion ratios, we highly recommend considering assembly inductors instead.
Absolutely! ITG is continuously dedicated to developing innovative solutions and expanding our molded inductor portfolio. For a performance upgrade, we highly recommend our SMF series (featuring flat wire technology), which significantly optimizes DCR, enhances Isat, and improves overall efficiency. Please feel free to contact the ITG sales team or visit our website to request samples or obtain technical support.
Absolutely! ITG is continuously dedicated to developing innovative solutions and expanding our molded inductor portfolio. For a performance upgrade, we highly recommend our SMF series (featuring flat wire technology), which significantly optimizes DCR, enhances Isat, and improves overall efficiency. Please feel free to contact the ITG sales team or visit our website to request samples or obtain technical support.
We generally do not recommend using molded inductors in applications with very high step-up/down voltage ratios, as they have relatively lower rated voltages compared to assembly inductors. Molded inductors are composed of high-density metal powders, where insulation relies entirely on a thin coating layer over each particle. During the high-tonnage compaction process, this coating layer can be slightly compromised, reducing the insulation resistance between the powder particles. When a high voltage is applied, this lower insulation resistance may lead to increased leakage current. Therefore, for designs requiring high voltage conversion ratios, we highly recommend considering assembly inductors instead.
Assembly Inductors: Typically offer lower DCR, lower core loss, and higher rated voltage.
This makes them exceptionally well-suited for high-current and high step-up/down ratio applications, such as core power supplies for CPUs, GPUs, and ASICs.
Molded Inductors: Feature highly flexible dimensions and better cost-efficiency. They are ideal for applications with severe space constraints, lower step-up/down ratios, or peripheral power rails (side rails) with moderate Isat requirements.
The main advantages of molded inductors include compact size, low EMI, and soft saturation performance. Consequently, they are highly suitable for applications with strict space limitations, stringent EMI requirements, or potential risks of sudden inductance collapse.
Isat (Saturation Current): Defines the amount of DC current that causes the inductance to drop by a specified percentage (typically 20% or 30%) due to magnetic saturation.
Irms (RMS Current): Focuses on the temperature rise of the inductor body, representing the continuous DC current that causes the component's temperature to increase by a specified increment (typically △T=40℃).
The primary advantage of the magnetic powder is its soft saturation characteristic.
Soft saturation means that as the DC current increases, the inductance drops gradually rather than dropping abruptly.
This prevents a sudden collapse of inductance, thereby protecting the circuit from current spikes.
The core differences between assembly and molded inductors lie in their manufacturing processes and physical structures.
- Assembly Inductors: Manufactured by assembling
coils with pre-formed magnetic cores, resulting in a structure with
distinct air gaps. - Molded Inductors: Constructed by placing
pre-wound coils into a mold, filling it with magnetic powder (typically
iron or alloy powder), and applying tonnage-level pressure to form a gapless
structure.
Due to this gapless design, molded inductors effectively minimize EMI and acoustic noise. Furthermore, the molding process allows for smaller, lower-profile form factors, making them ideal for space-constrained and cost-sensitive applications.