ITG offers a comprehensive range of molded power inductors, from compact 1.6x1.2 mm footprints to 17.0x17.0 mm high-current packages, supporting mobile, automotive, industrial, server, cloud computing, and high-performance power applications.
Built on four generations of technology development, ITG’s molded inductors have evolved from conventional round-wire structures to flat-wire windings, low-pressure molding, bottom-terminal designs, and advanced magnetic constructions. These innovations help reduce DCR, power loss, coil deformation, audible noise, and EMI while improving Isat, thermal performance, power density, and reliability.For high-efficiency applications, we recommend exploring our SMF Series.
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